共搜索到(848)条结果
品牌 产品编号

(生产商编号)

产品名称 等级 规格 零售价(RMB) CAS No.
AIST
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633-23171

Lead-Free Solder Chip (Sn96.5Ag3Cu0.5)– Pb Low Concentration

无铅焊料芯片(Sn96.5Ag3Cu0.5)-低浓度铅

- 50 g

-
FUJIFILM Wako
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353-30873

Poly(3-hexylthiophene-2,5-diyl), Average M.W. 70,000 - 100,000

聚(3-己基噻吩-2,5-二基) 平均分子量70,000 - 100,000

- 500 mg

125321-66-6
FUJIFILM Wako
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357-30871

Poly(3-hexylthiophene-2,5-diyl), Average M.W. 70,000 - 100,000

聚(3-己基噻吩-2,5-二基) 平均分子量70,000 - 100,000

- 100 mg

125321-66-6
FUJIFILM Wako
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320-53301

o-Cresolphthalein Complexone Disodium Salt

邻甲酚酞络合酮二钠盐

- 1 g

94442-10-1
FUJIFILM Wako
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326-53303

o-Cresolphthalein Complexone Disodium Salt

邻甲酚酞络合酮二钠盐

- 5 g

94442-10-1
FUJIFILM Wako
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324-20792

1,4-Diamino-2,3-dichloroanthraquinone

- 25g

81-42-5
FUJIFILM Wako
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和光纯药

201-20811

TBBT-Br2

for Functional Organic Materials 250mg

1810008-47-9
FUJIFILM Wako
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和光纯药

164-28291

3-Ethylthiophene Phenyl-C61-butyrate, 99%

for Functional Organic Materials 250mg

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